
切边
Edge trimming technology is not used usually in drawing technology for low-walledand box-shaped drawing parts.
在拉深工艺中,对于矮壁盒型拉深件,一般不采用。
Because after being drawn the edge of a drawing piece is no flattening generally it needs edge trimming to meet the demand usually realized by side-cutting and turn-cutting ***s.
由于拉伸件在拉伸后边缘不平整,一般需要修边才能达到要求,通常采用侧切和旋切模实现。
This machine can fulfill the processes such as paperboard printing (1~5 colors), creasing, edge trimming, slotting, corner cutting, hole punching and *** cutting etc in one cycle automatically…
能一次完成纸板1—5色印刷、压线、修边、开槽、切角、打孔、模切等多道工序。
Based on physical simulation of edge rolling process in Trimming-Free plate rolling method, the effection of V rolling and chamfer rolling on the plate profile is analyzed.
基于中厚板无切边轧制法中立轧轧边变形的物理模拟,分析了平辊立轧与倒棱轧制对中厚板断面形状的影响。
Based on physical simulation of edge rolling process in Trimming-Free plate rolling method, the affection of V rolling and chamfer rolling on the plate profile is analyzed.
基于中厚板无切边轧制法中立轧轧边变形的物理模拟,分析了平辊立轧与倒棱轧制对中厚板断面形状的影响。
|side cut;切边
“Edge trimming”是一个由“edge”(边缘)和“trimming”(修剪)组成的复合词,其含义需结合具体语境分析。以下是两种常见场景下的解释:
在半导体工艺中,Wafer Edge Trimming(晶圆边缘修整) 是一项关键技术。它通过去除晶圆(硅片)边缘多余的材料,使晶圆边缘达到特定形状和尺寸要求。
在非专业语境中,“edge trimming”可泛指对物体边缘的修整行为,例如:
如需进一步了解半导体领域的具体工艺,可参考的详细技术描述。
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