
切邊
Edge trimming technology is not used usually in drawing technology for low-walledand box-shaped drawing parts.
在拉深工藝中,對于矮壁盒型拉深件,一般不采用。
Because after being drawn the edge of a drawing piece is no flattening generally it needs edge trimming to meet the demand usually realized by side-cutting and turn-cutting ***s.
由于拉伸件在拉伸後邊緣不平整,一般需要修邊才能達到要求,通常采用側切和旋切模實現。
This machine can fulfill the processes such as paperboard printing (1~5 colors), creasing, edge trimming, slotting, corner cutting, hole punching and *** cutting etc in one cycle automatically…
能一次完成紙闆1—5色印刷、壓線、修邊、開槽、切角、打孔、模切等多道工序。
Based on physical simulation of edge rolling process in Trimming-Free plate rolling method, the effection of V rolling and chamfer rolling on the plate profile is analyzed.
基于中厚闆無切邊軋制法中立軋軋邊變形的物理模拟,分析了平輥立軋與倒棱軋制對中厚闆斷面形狀的影響。
Based on physical simulation of edge rolling process in Trimming-Free plate rolling method, the affection of V rolling and chamfer rolling on the plate profile is analyzed.
基于中厚闆無切邊軋制法中立軋軋邊變形的物理模拟,分析了平輥立軋與倒棱軋制對中厚闆斷面形狀的影響。
|side cut;切邊
“Edge trimming”是一個由“edge”(邊緣)和“trimming”(修剪)組成的複合詞,其含義需結合具體語境分析。以下是兩種常見場景下的解釋:
在半導體工藝中,Wafer Edge Trimming(晶圓邊緣修整) 是一項關鍵技術。它通過去除晶圓(矽片)邊緣多餘的材料,使晶圓邊緣達到特定形狀和尺寸要求。
在非專業語境中,“edge trimming”可泛指對物體邊緣的修整行為,例如:
如需進一步了解半導體領域的具體工藝,可參考的詳細技術描述。
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